Hoiho PCB

Capabilities

TECHNOLOGY

PCB Process
Capabilities

Multi Layer Stackup
(4~32L, e.g. 4L)

Advanced Stackup &
Laser Drill (4~32L)

PCB Process Capabilities

	Rigid PCB	Flexible PCB	Rigid Flex PCB
Layer	1 ~ 32L	1 ~ 6L	16L; FCCL < 4L
Finished Board Thickness	0.15~6.4mm	0.05~0.3mm	0.8~3.0mm
Max Panel Size	0.15~A6.4mm	500mm x 620mm	500mm x 620mm
Inner layer Copper	Max 3 oz	Max 2 oz	Max 2 oz
Outer Layer Copper	Max 6 oz	Max 2 oz	Max 2 oz
Material	TG130 / TG150 / TG170 / TG180、Halogen Free、CTI 600、Roger / Isola、PTFE (Taconic)、Al (1W/mK, 2W/mK, 3W/mK)	Polymide	TG130 / TG150 / TG170 / TG180、Polymide

1.Track width and Clearance:

	Rigid PCB		Flexible PCB		Rigid Flex PCB
	Min	Typ	Min	Typ	Min	Typ
Track width (mil/mm)	3/0.075	4/0.10	3/0.075	4/0.10	3/0.075	4/0.10
Tolerance of Track width	10%	20%	10%	20%	10%	20%
D0 (mil/mm)	4/0.10	6/0.15	4/0.10	6/0.15	4/0.10	6/0.15
D1 (mil/mm)	3/0.075	4/0.10	3/0.075	4/0.10	3/0.075	4/0.10

2.Via dimension (Mechanical) & Pad dimension:

2A.Via dimension		Rigid PCB		Flexible PCB		Rigid Flex PCB
2A.Via dimension		Min	Typ	Min	Typ	Min	Typ
D2 (mil/mm)		8/0.20	12/0.30	8/0.20	12/0.30	8/0.20	12/0.30
D3 (mil/mm)		16/0.40	20/0.50	16/0.40	20/0.50	16/0.40	20/0.50
D4 (mil/mm)		16/0.40	20/0.50	16/0.40	20/0.50	16/0.40	20/0.50
Size tolerance (mil/mm)	PTH hole	3/0.075	3/0.075	3/0.075	3/0.075	3/0.075	3/0.075
Size tolerance (mil/mm)	NPTH hole	2/0.05	2/0.05	2/0.05	2/0.05	2/0.05	2/0.05
Plating thickness in hole (mil/mm)				Avg	Typ	Avg	Typ
Plating thickness in hole (mil/mm)				0.8/0.020	1.0/0.0254	0.8/0.020	1.0/0.0254

2B. Pad dimension	Rigid PCB		Flexible PCB		Rigid Flex PCB
2B. Pad dimension	Min	Typ	Min	Typ	Min	Typ
D5 (mil/mm)	16/0.4	20/0.5	16/0.4	20/0.5	16/0.4	20/0.5
D6 (mil/mm)	8/0.2	12/0.3	8/0.2	12/0.3	8/0.2	12/0.3
D7 (mil/mm)	20/0.5	28/0.7	20/0.5	28/0.7	20/0.5	28/0.7

3. Soldermask:

	Flash gold board (bonding PCB)		Immersion gold board		Gold finger board
	Min	Typ	Min	Typ	Min	Typ
A Soldermask Opening	2/0.05	4/0.10	2/0.05 (Coverlay 4/0.1)	4/0.10	2/0.05	4/0.10
B Soldermask Dam	4/0.1 *Possible Peeloff	8/0.2	4/0.1 *Possible Peeloff (Coverlay 8/0.2)	8/0.2	4/0.1 *Possible Peeloff	8/0.2
C Pad to Trace Spacing	4/0.1 *Caution on Solder Short	8/0.2	4/0.1 *Caution on Solder Short	8/0.2	4/0.1 *Caution on Solder Short	8/0.2

4. Gold thickness and Nickel thickness:

	Flash gold board (bonding PCB)		Immersion gold board		Gold finger board
	Min	Typ	Min	Typ	Min	Typ
Gold thickness ( u" / um )	1/0.025	4/0.10	2/0.05	4/0.10	1/0.025	50/1.27
Nickel thickness ( u" / um )	120/3	400/10	120/3	400/10	120/3	400/10

5. Solder resist color


Soldermask	Green	Blue	White	Black	Red	Yellow
Coverlay	Yellow		White		Black

6. Surface Finishing


ENIG	LF HASL	OSP	Immersion Silver
Immersion Tin	Pb HASL	Gold Plating	ENEPIG

7.Silk screen

Dimension	Min	Typ
Outline width (mil/mm)	4/0.10	5/0.13
Designator width (mil/mm)	4/0.10	5/0.13
Designator height (mil/mm)	31/0.80	60/1.50
Clearance of near two designators (mil/mm)	4/0.10	6/0.15

8. Hole Handling

No cover

Soldermask Tending

Soldermask Plugging

Resin Plugging

VIPPO

9.Outline Tolerance

Technology	Min	Typ
Router	+/-0.05	+/-0.1
V-cut	+/-0.3	+/-0.5
Punching Tool (1 to 4L only)	+/-0.05	+/-0.1
Laser (FPC)	+/-0.05	+/-0.1

Multi Layer Stackup (4~32L, e.g. 4L)

Specification		Specification
Min Cu thickness (final)	H/H/H/H oz	Min Cu thickness (final)	H/H/H/H oz
Min Board thickness	0.4mm +/-0.1mm	Min Board thickness	0.4mm +/-0.1mm
Min hole size (PTH) final	0.2mm	Min hole size (PTH) final	0.2mm
Min hole size (NPTH) final	0.3mm	Min hole size (NPTH) final	0.3mm

Advanced Stackup & Laser Drill (4~32L)

Specification		Specification
Min Cu thickness (final)	H/H/H/H oz	Min Cu thickness (final)	H/H/H/H oz
Buried via size	0.1mm	Blind via size	0.1mm
		Min via in pad	0.15mm

QT SERVICES

Hoiho PCB offer standard PCB QT service, All files receive a full CAM review and all boards are inspected to IPC-A600 Class 2 or higher standards. Contact us for instant quote.

0 - 6 Layers

Layer Count

2 Days - 5 Days

Turn Time

1 - 1000+

Quantity Req.

FR-4 / FR4 TG170

Materials

Lead-Free HAL/ENIG

Plating Finish

IPC Class 2 - A600

Cert. / Qualifications

0.6~1.6mm

Board Thickness

4 / 4 Mils

Trace/Space

1 oz. Inner / Up to 2 oz. Outer

Copper Weight

QUALITY ASSURANCE

2D MEASURMENT MACHINE

AOI

BENDING TESTER

COPPER THICKNESS TESTER

E-TESTER

FLYING PROBE MACHINE

IMPEDANCE TESTER

IONIC-CONTAMINATION TESTER

LABORATORY

MICROSCOPE AND X-SECTION MEASUREMENT

PEEL STRENGTH TESTER

V-CUT REMAINING THICKNESS CHECKER

X-RAY CHECKER

CERTIFICATE

HOIHO works hard to obtain, maintain, and uphold the highest standards. The following certificate granted to us confirmed that we are consistently providing the utmost quality products and services to our customers.