Capabilities

TECHNOLOGY
PCB Process
Capabilities
Multi Layer Stackup
(4~32L, e.g. 4L)
Advanced Stackup &
Laser Drill (4~32L)
PCB Process Capabilities
Rigid PCB Flexible PCB Rigid Flex PCB
Layer 1 ~ 32L 1 ~ 6L 16L; FCCL < 4L
Finished Board Thickness 0.15~6.4mm 0.05~0.3mm 0.8~3.0mm
Max Panel Size 0.15~A6.4mm 500mm x 620mm 500mm x 620mm
Inner layer Copper Max 3 oz Max 2 oz Max 2 oz
Outer Layer Copper Max 6 oz Max 2 oz Max 2 oz
Material TG130 / TG150 / TG170 / TG180、Halogen Free、CTI 600、Roger / Isola、PTFE (Taconic)、Al (1W/mK, 2W/mK, 3W/mK) Polymide TG130 / TG150 / TG170 / TG180、Polymide

1.Track width and Clearance:

Rigid PCB Flexible PCB Rigid Flex PCB
Min Typ Min Typ Min Typ
Track width (mil/mm) 3/0.075 4/0.10 3/0.075 4/0.10 3/0.075 4/0.10
Tolerance of Track width 10% 20% 10% 20% 10% 20%
D0 (mil/mm) 4/0.10 6/0.15 4/0.10 6/0.15 4/0.10 6/0.15
D1 (mil/mm) 3/0.075 4/0.10 3/0.075 4/0.10 3/0.075 4/0.10

2.Via dimension (Mechanical) & Pad dimension:

2A.Via dimension Rigid PCB Flexible PCB Rigid Flex PCB
Min Typ Min Typ Min Typ
D2 (mil/mm) 8/0.20 12/0.30 8/0.20 12/0.30 8/0.20 12/0.30
D3 (mil/mm) 16/0.40 20/0.50 16/0.40 20/0.50 16/0.40 20/0.50
D4 (mil/mm) 16/0.40 20/0.50 16/0.40 20/0.50 16/0.40 20/0.50
Size tolerance (mil/mm) PTH hole 3/0.075 3/0.075 3/0.075 3/0.075 3/0.075 3/0.075
NPTH hole 2/0.05 2/0.05 2/0.05 2/0.05 2/0.05 2/0.05
Plating thickness in hole (mil/mm) Avg Typ Avg Typ
0.8/0.020 1.0/0.0254 0.8/0.020 1.0/0.0254
2B. Pad dimension Rigid PCB Flexible PCB Rigid Flex PCB
Min Typ Min Typ Min Typ
D5 (mil/mm) 16/0.4 20/0.5 16/0.4 20/0.5 16/0.4 20/0.5
D6 (mil/mm) 8/0.2 12/0.3 8/0.2 12/0.3 8/0.2 12/0.3
D7 (mil/mm) 20/0.5 28/0.7 20/0.5 28/0.7 20/0.5 28/0.7

3. Soldermask:

Flash gold board (bonding PCB) Immersion gold board Gold finger board
Min Typ Min Typ Min Typ
A
Soldermask Opening
2/0.05 4/0.10 2/0.05 (Coverlay 4/0.1) 4/0.10 2/0.05 4/0.10
B
Soldermask Dam
4/0.1
*Possible Peeloff
8/0.2 4/0.1
*Possible Peeloff
(Coverlay 8/0.2)
8/0.2 4/0.1
*Possible Peeloff
8/0.2
C
Pad to Trace Spacing
4/0.1
*Caution on Solder Short
8/0.2 4/0.1
*Caution on Solder Short
8/0.2 4/0.1
*Caution on Solder Short
8/0.2

4. Gold thickness and Nickel thickness:

Flash gold board (bonding PCB) Immersion gold board Gold finger board
Min Typ Min Typ Min Typ
Gold thickness
( u" / um )
1/0.025 4/0.10 2/0.05 4/0.10 1/0.025 50/1.27
Nickel thickness
( u" / um )
120/3 400/10 120/3 400/10 120/3 400/10

5. Solder resist color

Soldermask Green Blue White Black Red Yellow
Coverlay Yellow White Black

6. Surface Finishing

ENIG LF HASL OSP Immersion Silver
Immersion Tin Pb HASL Gold Plating ENEPIG

7.Silk screen

Dimension Min Typ
Outline width (mil/mm) 4/0.10 5/0.13
Designator width (mil/mm) 4/0.10 5/0.13
Designator height (mil/mm) 31/0.80 60/1.50
Clearance of near two designators (mil/mm) 4/0.10 6/0.15

8. Hole Handling

No cover Soldermask Tending Soldermask Plugging Resin Plugging VIPPO

9.Outline Tolerance

Technology Min Typ
Router +/-0.05 +/-0.1
V-cut +/-0.3 +/-0.5
Punching Tool (1 to 4L only) +/-0.05 +/-0.1
Laser (FPC) +/-0.05 +/-0.1
Multi Layer Stackup (4~32L, e.g. 4L)
Structure Specification Structure Specification
Min Cu thickness (final) H/H/H/H oz Min Cu thickness (final) H/H/H/H oz
Min Board thickness 0.4mm +/-0.1mm Min Board thickness 0.4mm +/-0.1mm
Min hole size (PTH) final 0.2mm Min hole size (PTH) final 0.2mm
Min hole size (NPTH) final 0.3mm Min hole size (NPTH) final 0.3mm
Advanced Stackup & Laser Drill (4~32L)
Buried Via Specification Blind Via Specification
Min Cu thickness (final) H/H/H/H oz Min Cu thickness (final) H/H/H/H oz
Buried via size 0.1mm Blind via size 0.1mm
Min via in pad 0.15mm
QT SERVICES
Hoiho PCB offer standard PCB QT service, All files receive a full CAM review and all boards are inspected to IPC-A600 Class 2 or higher standards. Contact us for instant quote.
0 - 6 Layers
Layer Count
2 Days - 5 Days
Turn Time
1 - 1000+
Quantity Req.
FR-4 / FR4 TG170
Materials
Lead-Free HAL/ENIG
Plating Finish
IPC Class 2 - A600
Cert. / Qualifications
0.6~1.6mm
Board Thickness
4 / 4 Mils
Trace/Space
1 oz. Inner / Up to 2 oz. Outer
Copper Weight
QUALITY ASSURANCE
CERTIFICATE
HOIHO works hard to obtain, maintain, and uphold the highest standards. The following certificate granted to us confirmed that we are consistently providing the utmost quality products and services to our customers.
CONTACT
Europe
Elmatec NV Mosten 13, 9160 Lokeren, Belgium
Tel:(32) 5248 0445
Fax:(32) 5248 0417
Bert Buyle
Hong Kong
5-N, Kaiser Estate Phase III,9 Hok Yuen Street, Hung Hom,Kowloon, Hong Kong
Tel: (852) 2333 3102
Fax: (852) 2333 0890
MT Leung
China
6Q, Jingdacheng Building, Zhongxin Road, Shajing Town, ShenZhen City, GuangDong Province, China
Tel: (86) 755 2910 6022
Look Huang
Singapore / Malaysia
MT Leung
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